| MRC | Criteria | Characteristic |
|---|
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CQZP | INPUT CIRCUIT PATTERN | 22 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-9 MIL-M-38510 |
| TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
| ADAT | BODY WIDTH | 0.290 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 180.00 MILLIAMPERES REVERSE CURRENT,DC ABSOLUTE |
| FEAT | SPECIAL FEATURES | ALTERED ITEM PROGRAMMED USING 14933/5962-8605301LX ACCORDING TO VDD 5216099 AND SCI CONTROL NUMBER E101164-003;22 MHZ MAX CLOCK FREQUENCY;ESD |
| ADAU | BODY HEIGHT | 0.180 INCHES MINIMUM AND 0.200 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.2 WATTS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEQ | TIME RATING PER CHACTERISTIC | 30.00 NANOSECONDS MAXIMUM PROPAGATION DELAY |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| ADAQ | BODY LENGTH | 1.260 INCHES MINIMUM AND 1.280 INCHES MAXIMUM |
| CBBL | FEATURES PROVIDED | BIPOLAR AND BURN IN,MIL-STD-883,CLASS B AND ELECTROSTATIC SENSITIVE AND PROGRAMMED AND TESTED TO MIL-STD-883 |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | ALTERED ITEM DRAWING MICRO CIRCUIT ADC CARD PAL LOW LEVEL DECODER ADC |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM TOTAL SUPPLY AND 7.0 VOLTS MAXIMUM TOTAL SUPPLY AND-0.5 VOLTS MINIMUM INPUT AND 5.5 VOLTS MAXIMUM INPUT |
