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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-372-1262 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013721262 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
NH15-1326285-1 | 2 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
AEHX | MAXIMUM POWER DISSIPATION RATING | 1.0 WATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | RADIATION HARDENED AND ELECTROSTATIC SENSITIVE |
CRTL | CRITICALITY CODE JUSTIFICATION | FEAT |
CZEQ | TIME RATING PER CHACTERISTIC | 55.00 NANOSECONDS NOMINAL ACCESS |
ZZZX | DEPARTURE FROM CITED DESIGNATOR | MODIFIED FOR NUCLEAR HARDNESS IMPACT |
AGAV | END ITEM IDENTIFICATION | HAC/RMPE REAC E/I FSCM 11293 |
ZZZP | PURCHASE DESCRIPTION IDENTIFICATION | 11293-15-1326285-1 |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM INPUT AND 6.0 VOLTS MAXIMUM INPUT |
CZES | HYBRID TECHNOLOGY TYPE | MONOLITHIC |
FEAT | SPECIAL FEATURES | CBBL |
NHCF | NUCLEAR HARDNESS CRITICAL FEATURE | HARDENED |
TEST | TEST DATA DOCUMENT | 81349-MIL-M-38510 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTI |
TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
ZZZK | SPECIFICATION/STANDARD DATA | 67268-5962-8866203UA GOVERNMENT STANDARD |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | LEADED CHIP CARRIER |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | C-11 MIL-M-38510 |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,SRAM,32K X 8(CY7C197) |
CZER | MEMORY DEVICE TYPE | RAM |
CZZZ | MEMORY CAPACITY | 128KX8 |
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