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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-447-2495 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 014472495 | 0 | N | D | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | D | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
8522733-701 | 5 | 2 | 1 |
MRC | Criteria | Characteristic |
---|---|---|
CZEN | Voltage Rating And Type Per Characteristic | -0.5 VOLTS MINIMUM INPUT AND 7.0 VOLTS MAXIMUM INPUT |
AGAV | End Item Identification | F16AIRCOMBFIT |
CZEQ | Time Rating Per Chacteristic | 35.00 NANOSECONDS NOMINAL ACCESS |
CZER | Memory Device Type | RAM |
AFJQ | Storage Temp Range | -65.0 TO 150.0 DEG CELSIUS |
ADAT | Body Width | 0.392 INCHES MINIMUM AND 0.408 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
TTQY | Terminal Type And Quantity | 32 LEADLESS |
CBBL | Features Provided | MONOLITHIC AND ELECTROSTATIC SENSITIVE AND LOW POWER AND BURN IN, MIL-STD-883, CLASS B |
FEAT | Special Features | SELECTION CRITERIA BASED ON DATA RETENTION CURRENT (ICC4),PER 3.2 OF DRAWING |
MRC | Decoded Requirement | Clear Text Reply |
CXCY | Part Name Assigned By Controlling Agency | MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 128K X 8 STATIC RANDOM ACCESS MEMORY (SRAM) LOW POWER, DUAL CE |
ADAQ | Body Length | 0.800 INCHES MINIMUM AND 0.840 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 1.0 WATTS |
ADAU | Body Height | 0.080 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CQSZ | Inclosure Configuration | LEADLESS FLAT PACK |
AFGA | Operating Temp Range | -55.0 TO 125.0 DEG CELSIUS |
CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
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