If your operations demand part number HM6264LP-12, an item produced by Hitachi Magnetics Corp and listed with the description “Microcircuit Memory,” look no further than this page. At your convenience, you can complete the Request for Quote (RFQ) form below with details like your budget, desired quantity, and anticipated fulfillment timeline to receive customized procurement options on part number HM6264LP-12. Our representatives will happily treat you to competitive pricing and swift lead times upon their receipt and review of a completed form, regularly responding in 15 minutes or less.
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If you are interested, be sure to explore our website further for related CAGE Code 52531 items or other various products manufactured by Hitachi Magnetics Corp. We also present a catalog of all related FSC 5962 Microcircuits Electronic parts that we currently carry for your perusal. Regardless of what you decide to purchase from us, we will work closely with you to provide dependable, authentic products while ensuring that we address every requirement possible. This being said, get started on requesting quotes for part number HM6264LP-12 and any other NSN parts you need on Sky Forge Components to experience our unrivaled fulfillment services.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-259-2035 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012592035 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| HM6264LP-12 | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.400 INCHES NOMINAL |
| ADAT | BODY WIDTH | 0.594 INCHES NOMINAL |
| ADAU | BODY HEIGHT | 0.280 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 4.0 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | LOW POWER AND HERMETICALLY SEALED AND HIGH SPEED AND MONOLITHIC |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 23 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 0.5 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 120.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 PRINTED CIRCUIT |
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