If your operations demand part number 2747G-1, an item produced by Lockheed Martin Sippican Inc and listed with the description “Semiconductor Devices Unitized,” look no further than this page. At your convenience, you can complete the Request for Quote (RFQ) form below with details like your budget, desired quantity, and anticipated fulfillment timeline to receive customized procurement options on part number 2747G-1. Our representatives will happily treat you to competitive pricing and swift lead times upon their receipt and review of a completed form, regularly responding in 15 minutes or less.
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If you are interested, be sure to explore our website further for related CAGE Code 13030 items or other various products manufactured by Lockheed Martin Sippican Inc. We also present a catalog of all related FSC 5961 Semiconductor Devices and Associated Hardware parts that we currently carry for your perusal. Regardless of what you decide to purchase from us, we will work closely with you to provide dependable, authentic products while ensuring that we address every requirement possible. This being said, get started on requesting quotes for part number 2747G-1 and any other NSN parts you need on Sky Forge Components to experience our unrivaled fulfillment services.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-01-298-7957 Item PartTypeName: SEMICONDUCTOR DEVICES,UNITIZED | 5961 | 012987957 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 2747G-1 | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS AND METAL |
| ABHP | OVERALL LENGTH | 0.320 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.255 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.225 INCHES MAXIMUM |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-13 |
| ALBA | ELECTRODE INTERNALLY-ELECTRICALLY CONNECTED TO CASE | COLLECTOR |
| ASKA | COMPONENT NAME AND QUANTITY | 2 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 8.8 MAXIMUM BREAKDOWN VOLTAGE,DC ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MILLIAMPERES FORWARD CURRENT,TOTAL RMS NANOAMPERES ALL SEMICONDUCTOR DEVICE DIODE |
| CTRD | POWER RATING PER CHARACTERISTIC | 1500.0 WATTS SMALL-SIGNAL INPUT POWER,COMMON-COLLECTOR MAJOR ALL SEMICONDUCTOR DEVICE DIODE |
| CTRG | CAPACITANCE RATING IN PICOFARADS | 100.0 MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 175.0 DEG CELSIUS AMBIENT AIR |
| FEAT | SPECIAL FEATURES | ALL SEMICONDUCTOR DEVICE DIODE JUNCTION PATTERN ARRANGEMENT: PN |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
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