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| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5961-00-160-1805 Item PartTypeName: SEMICONDUCTOR DEVICE SET | 5961 | 001601805 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | G | ||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| MA4932MR4 | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | METAL ALL SEMICONDUCTOR DEVICE DIODE |
| ABHP | OVERALL LENGTH | 0.735 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.765 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| ADAV | OVERALL DIAMETER | 0.215 INCHES MINIMUM ALL SEMICONDUCTOR DEVICE DIODE AND 0.220 INCHES MAXIMUM ALL SEMICONDUCTOR DEVICE DIODE |
| AFZC | FUNCTION FOR WHICH DESIGNED | MICROWAVE AND MIXER |
| ALAS | INTERNAL CONFIGURATION | JUNCTION CONTACT ALL SEMICONDUCTOR DEVICE DIODE |
| ASCQ | INTERNAL JUNCTION CONFIGURATION | PN ALL SEMICONDUCTOR DEVICE DIODE |
| ASDD | COMPONENT FUNCTION RELATIONSHIP | MATCHED |
| ASKA | COMPONENT NAME AND QUANTITY | 4 SEMICONDUCTOR DEVICE DIODE |
| AXGY | MOUNTING METHOD | PRESS FIT ALL SEMICONDUCTOR DEVICE DIODE |
| CBBL | FEATURES PROVIDED | BURN IN |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON ALL SEMICONDUCTOR DEVICE DIODE |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 10.00 MILLIAMPERES MAXIMUM FORWARD CURRENT,DC ALL SEMICONDUCTOR DEVICE DIODE |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 150.0 DEG CELSIUS AMBIENT AIR ALL SEMICONDUCTOR DEVICE DIODE |
| FEAT | SPECIAL FEATURES | TWO OF THE FOUR DIODES WILL BE FORWARD DIODES AND TWO WILL BE REVERSE DIODES |
| PRMT | PRECIOUS MATERIAL | GOLD |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 PIN ALL SEMICONDUCTOR DEVICE DIODE |
| ZZZK | SPECIFICATION/STANDARD DATA | 18876-10658352 MANUFACTURERS SOURCE CONTROL |
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