If your operations demand part number DM5213 300 SLB, an item produced by Seeq Technology Inc and listed with the description “Microcircuit Memory,” look no further than this page. At your convenience, you can complete the Request for Quote (RFQ) form below with details like your budget, desired quantity, and anticipated fulfillment timeline to receive customized procurement options on part number DM5213 300 SLB. Our representatives will happily treat you to competitive pricing and swift lead times upon their receipt and review of a completed form, regularly responding in 15 minutes or less.
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If you are interested, be sure to explore our website further for related CAGE Code 61394 items or other various products manufactured by Seeq Technology Inc. We also present a catalog of all related FSC 5962 Microcircuits Electronic parts that we currently carry for your perusal. Regardless of what you decide to purchase from us, we will work closely with you to provide dependable, authentic products while ensuring that we address every requirement possible. This being said, get started on requesting quotes for part number DM5213 300 SLB and any other NSN parts you need on Sky Forge Components to experience our unrivaled fulfillment services.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-199-9161 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 011999161 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
201842-001 | 3 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.3 VOLTS MINIMUM POWER SOURCE AND 6.0 VOLTS MAXIMUM POWER SOURCE |
CZEQ | TIME RATING PER CHACTERISTIC | 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 300.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 81413-201842 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 855.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/125.0 DEG CELSIUS |
AGAV | END ITEM IDENTIFICATION | RECEIVING SET,COUNTERMEASURES AN/ALR-56C |
CBBL | FEATURES PROVIDED | MONOLITHIC AND ERASABLE AND PROGRAMMABLE AND ELECTROSTATIC SENSITIVE AND W/ENABLE AND BIDIRECTIONAL |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 21 INPUT |
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