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NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-364-1268 Item PartTypeName: MICROCIRCUIT,DIGITAL | 5962 | 013641268 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | G | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
10082097-101 | 5 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
PRMT | PRECIOUS MATERIAL | GOLD |
TTQY | TERMINAL TYPE AND QUANTITY | 40 PRINTED CIRCUIT |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MINIMUM ABSOLUTE INPUT AND 15.0 VOLTS MAXIMUM ABSOLUTE INPUT |
AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-5 MIL-M-38510 |
AGAV | END ITEM IDENTIFICATION | 6605013131810 E/I FSCM 57274 |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
CSSL | DESIGN FUNCTION AND QUANTITY | 1 GATE,ARRAY |
CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,DIGITAL(GATE ARRAY)READOUT |
FEAT | SPECIAL FEATURES | MICROCIRCUITS SHALL BE GLASSIVATED |
PMLC | PRECIOUS MATERIAL AND LOCATION | PACKAGE CAVITY GOLD |
SPCL | SPECIAL TEST FEATURES | GOLD EUTECTIC DIE BOND USED IN PACKAGE CAVITY |
TEST | TEST DATA DOCUMENT | 94580-10082097 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTING |
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