If your operations demand part number IMS1600S-55M, an item produced by Sgs Thompson Microelectronics Inc and listed with the description “Microcircuit Memory,” look no further than this page. At your convenience, you can complete the Request for Quote (RFQ) form below with details like your budget, desired quantity, and anticipated fulfillment timeline to receive customized procurement options on part number IMS1600S-55M. Our representatives will happily treat you to competitive pricing and swift lead times upon their receipt and review of a completed form, regularly responding in 15 minutes or less.
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If you are interested, be sure to explore our website further for related CAGE Code 60911 items or other various products manufactured by Sgs Thompson Microelectronics Inc. We also present a catalog of all related FSC 5962 Microcircuits Electronic parts that we currently carry for your perusal. Regardless of what you decide to purchase from us, we will work closely with you to provide dependable, authentic products while ensuring that we address every requirement possible. This being said, get started on requesting quotes for part number IMS1600S-55M and any other NSN parts you need on Sky Forge Components to experience our unrivaled fulfillment services.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-270-0226 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 012700226 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IMS1600S-55M | 2 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAQ | BODY LENGTH | 1.260 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.220 INCHES MINIMUM AND 0.310 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.210 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 1.6 WATTS |
| AFGA | OPERATING TEMP RANGE | -55.0 TO 125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0 TO 150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | ELECTROSTATIC SENSITIVE AND HERMETICALLY SEALED AND BURN IN |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
| CQWX | OUTPUT LOGIC FORM | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 19 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -2.0 VOLTS MINIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | RAM |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 22 PRINTED CIRCUIT |
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